Power Module Packaging Market Revenue Poised for Significant Growth During the Forecast Period of 2022 - 2032 | Emergen Research
The latest research report by Emergen research named ‘Global Power Module Packaging market - Forecast to 2030’, entails a comprehensive review of the global Power Module Packaging market’s present and future trends. The report gathers viable information on the most established industry players, sales and distribution channels, regional spectrum, estimated market share and size, and revenue estimations over the forecast timeframe. The study is inclusive of a profound analysis of this business sphere focuses on the overall remuneration of the market over the projected period.
The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.
Covid 19 impact analysis :
The study also includes significant information pertinent to the Power Module Packaging market industry, particularly the current COVID-19 scenario. Exhaustive coverage of the COVID-19 impact on the Power Module Packaging market industry is a major attraction of the report. The global health emergency has beleaguered the global economy, thereby disrupting this particular business domain’s functioning mechanism.
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How will this Report Benefit you?
An Emergen Research report of 250 pages features 194 tables, 189 charts, and graphics. Our new study is ideal for anyone who wants to learn about the global Power Module Packaging market commercially and deeply, as well as to analyze the market segments in depth. With the help of our recent study, you can analyze the entire regional and global market for Power Module Packaging. To increase market share, you must obtain financial analysis of the entire market and its segments. Our research suggests there are significant opportunities in this rapidly expanding market for energy storage technology. Look at how you might take advantage of these revenue-generating opportunities. Additionally, the research will help you develop growth strategies, strengthen competitor analysis, and improve business productivity by enabling you to make better strategic decisions.
Top key aspirants:
SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc
Research objectives:
- The global Power Module Packaging market report studies the worldwide market consumption rate in terms of value and volume.
- It identifies the various sub-segments of the market structure.
- It proffers information regarding the leading global manufacturers in this industry, describing their market value & share, sales volume, competitive analysis, SWOT analysis, and development strategies adopted during the forecast timeline.
- The report describes the key industry players, with respect to their individual growth trends, future prospects, and contribution to the global market, and explains the factors related to their market growth potential, drivers, opportunities, threats, and industry-specific challenges.
- Furthermore, the report underpins the strategic developments occurring in the global Power Module Packaging market
To learn more details about the Global Power Module Packaging market report, visit @ https://www.emergenresearch.com/industry-report/power-module-packaging-market
Segmentation:
Power Module Type Outlook (Revenue, USD Billion; 2019-2032)
- Silicon Carbide (SiC) Module
- Gallium Nitride (GaN) Module
- Insulated-Gate Bipolar Transistor (IGBT) Module
- Field-Effect Transistor (FET) Module
- Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
- Others
Technology Outlook (Revenue, USD Billion; 2019-2032)
- Standard Packaging
- Advanced Packaging
- Pressure-Contact Modules
- Others
Thermal type Outlook (Revenue, USD Billion; 2019-2032)
- Liquid-Cooled
- Air-Cooled
- Hybrid
Global Power Module Packaging market Geographical Landscape - Synopsis:
- The report closely studies the growth trajectory of the global Power Module Packaging market. It brings to light the global dominance of the leading regional segments, including North America, Asia Pacific, Europe, Latin America, and the Middle East & Africa.
- The study elaborates on the crucial information pertaining to the regional market share. It simultaneously focuses on the significant details about the growth patterns of each regional market.
- Moreover, the report encases an exhaustive geographical study of the market, emphasizing the business growth prospects and market barriers for each of the key market regions.
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The report, additionally, offers a comprehensive SWOT analysis and Porter’s Five Forces analysis to offer a better understanding of the competitive landscape of the industry. It also covers strategies adopted by prominent players such as mergers and acquisitions, collaborations, joint ventures, product launches, and brand promotions, among others. The report aims to offer the readers a holistic understanding of the relevant features of the industry.
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TOC of the global Power Module Packaging Market report:
Chapter 1, describes the Power Module Packaging Market Introduction, market overview, product offerings, growth opportunities, market risks, driving forces, and challenges.
Chapter 2, analyzes the key manufacturers of Power Module Packaging Market , along with the sales, revenue, and price of Power Module Packaging Market , in the forecast period.
Chapter 3, studies the competitive situation among the major manufacturers and vendors, with sales, revenue, and market share.
Chapter 4, analyzes the global market by regions, with sales, revenue, and market share of Power Module Packaging Market, for each region, from 2020 to 2032.
Chapters 5, 6, 7, 8 and 9, analyze the Power Module Packaging Market by type, application, regions, and manufacturers, with sales, revenue, and market share by key countries in these regions…Continued
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